在電子產品的生產過程中，由于電子元件的生產和組裝，由多個階段構成，因此在此過程中，元件很可能會受到污染顆粒的沾污，導致電子元件出現品質問題，如腐蝕銹蝕、失效、短路等。

　　In the production process of electronic products, due to the production and assembly of electronic components, which is composed of multiple stages, the components are likely to be contaminated by contaminated particles, resulting in quality problems of electronic components, such as corrosion, failure, short circuit, etc.

　　所以很多生產線會對元件采用清洗的工藝過程。有時，在生產線上的清洗過程之后，我們會發現薄膜電容器的頂層有一些剝落現象。

　　Therefore, many production lines will adopt cleaning process for components. Sometimes, after the cleaning process on the production line, we will find some peeling phenomenon on the top layer of the film capacitor.

　　    當薄膜電容器在上板焊接過程之后進行清洗, 或受到過度的機械應力或沖洗時，就可能會發生這種剝落現象。

　　This kind of spalling may occur when the thin film capacitor is cleaned after the welding process of the upper plate, or is subjected to excessive mechanical stress or flushing.

　　    為了防止這種剝落現象導致元件性能下降，一些供應商在薄膜電容器的頂部和底部都制作了超過50層的保護膜，這樣就能避免薄膜電容器不會因這種表面剝落而劣化。即使剝落所有的保護膜，這類薄膜電容器的電氣性能和可靠性特性也不會受到影響。

　　In order to prevent the performance degradation caused by this spalling phenomenon, some suppliers have made more than 50 layers of protective film on the top and bottom of the thin film capacitor, so as to avoid the deterioration of the film capacitor due to the surface peeling. Even if all the protective film is peeled off, the electrical performance and reliability characteristics of this kind of film capacitor will not be affected.